BURN IN TEST | EQUIP TEST

What Is Burn-in Test?

 

The burn-in test is a test of electrical and thermal that stress in any semiconductor device for detecting early failure. There are three types of semiconductors failure such as early failure, random failure, or wear-out failure. This test has two types static burn-in testing and dynamic burn-in testing. Ages of practice those discover excellent techniques to predict the system’s validity. These techniques are determined to protect systems from damages and failures. 

 

Burn-in test is a technique to finds the fault in a semiconductor device or a failure before getting assembled in any system. This test forces every device to reach its maximum limit till it becomes a failure. The whole process is taken under the expert’s supervision also the capacity of the device is analyzed. It improves the reliability of the component to be used in a system. The Burn-in test is critical in removing defective parts from the production line after they have been manufactured.

 

Types of Burn test failures,

 

• Early failure can be found at the initial stages of any semiconductor device during operation. It helps in analyzing the early failure rate.
• Random failure can be found over a long period where the failure rate is constant. It helps in analyzing uncertain failures. 
• Wear-out seems to occur at the end of the production line testing. The devices frequently undergo this failure as compare to Early and Random failure rates.

 

A Burn-in test is a process for detecting and discarding defective solid-state electronic components before they are sold or incorporated into electronic devices. 

 

Equip-Test probes like High-Current probes were designed to reach high pointing accuracy and lifelong durability. High-Current probes are categories under their load capacity such as high-current probes up to 20 amperes, two types of high-current probes up to 30 amperes, and two probes up to 50 amperes. This test is one of the applications of these test probes to prove their reliability. The high-current probe has its own unique designer tip. Each and every test probe was designed to be more productive and easy to handle.